P.C.B SIZE (尺寸)

Maximum active Panel size ( 最大工作尺寸 )

18 ” *26 ”(457mm*680mm)

THICKNESS ( 厚度 )

Maximum processed/finished thickness ( 最大成品板厚 )

3.8 mm

Minimum processed/finished thickness ( 最小成品板厚 )

0.3 mm

Board thickness tolerance ( 成品板厚公差 )

+/- 3mil

War page /bow and twist inch per inch ( 板彎翹規格 )

0.7%

LAYER CONSTRUCTION ( 層數結構 )

Maximum processed layer count ( 最大生產層數 )

24 L

Minimum core thickness ( 最小基板厚度 )

0.075mm

Minimum Dielectric thickness ( 最小絕緣層厚度 )

0.05mm

ASPECT RATIO ( 電鍍縱橫比 )

Maximum aspect ratio- plated through holes ( 最大貫穿孔電鍍縱橫比 )

1: 8

MECHANICALLY DRILLED HOLE SIZES ( 機械貫通孔孔徑 )

Minimum mechanically drilled through holes size ( 最小機械貫通孔孔徑 )

0.15mm

Smallest finished PTH ( 最小的成品孔徑 )

0.1mm

HOLE SIZE TOLERANCE ( 孔徑公差 )

PTH Hole size standard tolerance (PTH 孔孔徑公差 )

0.075mm

NPTH Hole size standard tolerance (NPTH 孔孔徑公差 )

0.05mm

True position tolerance ( 精確度 )

0.025

Minimum CONDUCTOR WIDTH ( 最小線寬 )

Minimum trace width inner layer ( 最小內層線寬 )

0.075mm

Minimum trace width outer layer ( 最小外層線寬 )

0.075mm

Minimum CONDUCTOR SPACE ( 最小線距 )

Minimum space copper to copper inner layer ( 最小內層線距 )

0.1mm

Minimum space copper to Copper outer layer ( 最小外層線距 )

0.1mm

Minimum space drill to copper ( 最小孔邊到線距 )

0.15mm

Minimum annular ring inner layer ( 最小內層孔環 )

0.1mm

Minimum annular ring outer layer ( 最小外層孔環 )

0.075mm

Minimum plane clearance inner layer ( 最小內層隔離孔環 )

0.2mm

Minimum plane clearance outer layer ( 最小外層隔離孔環 )

0.15mm

CONTROLLED IMPEDANCE ( 阻抗控制 )

Impedance typical – value ohms ( 最具代表性的阻抗值 )

50Ω , 90Ω , 100Ω

Impedance typical – tolerance ( 最具代表性的公差 )

+/- 10%

Impedance modeling tool ( 阻抗模擬工具 )

Polar cits25

Impedance measurement technique (equipment/type) ( 阻抗量測設備型號 )

Polar cits500

TECHNOLOGY ( 技術 )

Buried vias – mechanically ( 機械埋孔 )

Yes

Blind vias – mechanically ( 機械盲孔 )

Yes

Buried micro vias (through an individual internal laminate) ( 內埋微小盲孔 )

Yes

Conductive via fill ( 孔內導電填孔 )

Yes

SOLDER MASK AND LEGEND ( 防焊 )

Nominal solder mask thickness ( 防焊厚度 )

0.01mm

Solder mask type ( 防焊種類 )

Liquid

Minimum solder mask clearance to pad ( 最小防焊隔離環 )

0.05mm

SURFACE FINISHES ( 完成的表面處理 )

HASL ( 有鉛噴錫 )

Yes

HASL (lead free) ( 無鉛噴錫 )

Yes

Electrolytic NI/Gold ( 電鍍鎳金 )

Yes

Electroless Ni/Immersion Gold ( 化學鎳金 )

Yes

Immersion Tin ( 化學錫 )

Yes

Immersion Silver ( 化學銀 )

Yes

OSP (entek)( 有機保焊 )

Yes

Soft Gold ( 軟金 )

Yes

Selective Immersion Gold ( 選擇化金 )

Yes

ELECTRICAL TEST ( 測試 )

Net list extraction ( Net list 取出 )

Yes

Net list comparison (Net list 比對 )

Yes

Simultaneous top and bottom 100% net list (open/short 同時 100% 雙面測 )

Yes

Continuity ( 通路 ) voltage 250V short 25M

Yes

Isolation ( 斷路 ) voltage 250V Open 15 Ω

Yes

Impedance test in circuit ( 線路內阻抗測試 )

Yes

Impedance test on coupon ( 阻抗條測試 )

Yes

 

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