|
P.C.B SIZE (尺寸) |
|
Maximum active Panel size (
最大工作尺寸 ) |
18 ” *26 ”(457mm*680mm) |
|
THICKNESS (
厚度 ) |
|
Maximum processed/finished
thickness (
最大成品板厚 ) |
3.8 mm |
|
Minimum processed/finished
thickness (
最小成品板厚 ) |
0.3 mm |
|
Board thickness tolerance (
成品板厚公差 ) |
+/- 3mil |
|
War page /bow and twist inch per
inch (
板彎翹規格 ) |
0.7% |
|
LAYER CONSTRUCTION (
層數結構 ) |
|
Maximum processed layer count (
最大生產層數 ) |
24 L |
|
Minimum core thickness (
最小基板厚度 ) |
0.075mm |
|
Minimum Dielectric thickness (
最小絕緣層厚度 ) |
0.05mm |
|
ASPECT RATIO (
電鍍縱橫比 ) |
|
Maximum aspect ratio- plated
through holes (
最大貫穿孔電鍍縱橫比 ) |
1: 8 |
|
MECHANICALLY DRILLED HOLE SIZES
(
機械貫通孔孔徑 ) |
|
Minimum mechanically drilled
through holes size (
最小機械貫通孔孔徑 ) |
0.15mm |
|
Smallest finished PTH (
最小的成品孔徑 ) |
0.1mm |
|
HOLE SIZE TOLERANCE (
孔徑公差 ) |
|
PTH Hole size standard tolerance
(PTH
孔孔徑公差 ) |
0.075mm |
|
NPTH Hole size standard
tolerance (NPTH
孔孔徑公差 ) |
0.05mm |
|
True position tolerance (
精確度 ) |
0.025 |
|
Minimum CONDUCTOR WIDTH (
最小線寬 ) |
|
Minimum trace width inner layer
(
最小內層線寬 ) |
0.075mm |
|
Minimum trace width outer layer
(
最小外層線寬 ) |
0.075mm |
|
Minimum CONDUCTOR SPACE (
最小線距 ) |
|
Minimum space copper to copper
inner layer (
最小內層線距 ) |
0.1mm |
|
Minimum space copper to Copper
outer layer (
最小外層線距 ) |
0.1mm |
|
Minimum space drill to copper (
最小孔邊到線距 ) |
0.15mm |
|
Minimum annular ring inner layer
(
最小內層孔環 ) |
0.1mm |
|
Minimum annular ring outer layer
(
最小外層孔環 ) |
0.075mm |
|
Minimum plane clearance inner
layer (
最小內層隔離孔環 ) |
0.2mm |
|
Minimum plane clearance outer
layer (
最小外層隔離孔環 ) |
0.15mm |
|
CONTROLLED IMPEDANCE (
阻抗控制 ) |
|
Impedance typical – value ohms (
最具代表性的阻抗值 ) |
50Ω
,
90Ω
,
100Ω |
|
Impedance typical – tolerance (
最具代表性的公差 ) |
+/- 10% |
|
Impedance modeling tool (
阻抗模擬工具 ) |
Polar cits25 |
|
Impedance measurement technique
(equipment/type) (
阻抗量測設備型號 ) |
Polar cits500 |
|
TECHNOLOGY (
技術 ) |
|
Buried vias – mechanically (
機械埋孔 ) |
Yes |
|
Blind vias – mechanically (
機械盲孔 ) |
Yes |
|
Buried micro vias (through an
individual internal laminate) (
內埋微小盲孔 ) |
Yes |
|
Conductive via fill (
孔內導電填孔 ) |
Yes |
|
SOLDER MASK AND LEGEND (
防焊 ) |
|
Nominal solder mask thickness (
防焊厚度 ) |
0.01mm |
|
Solder mask type (
防焊種類 ) |
Liquid |
|
Minimum solder mask clearance to
pad (
最小防焊隔離環 ) |
0.05mm |
|
SURFACE FINISHES (
完成的表面處理 ) |
|
HASL (
有鉛噴錫 ) |
Yes |
|
HASL (lead free) (
無鉛噴錫 ) |
Yes |
|
Electrolytic NI/Gold (
電鍍鎳金 ) |
Yes |
|
Electroless Ni/Immersion Gold (
化學鎳金 ) |
Yes |
|
Immersion Tin (
化學錫 ) |
Yes |
|
Immersion Silver (
化學銀 ) |
Yes |
|
OSP (entek)(
有機保焊 ) |
Yes |
|
Soft Gold (
軟金 ) |
Yes |
|
Selective Immersion Gold (
選擇化金 ) |
Yes |
|
ELECTRICAL TEST (
測試 ) |
|
Net list extraction ( Net list
取出 ) |
Yes |
|
Net list comparison (Net list
比對 ) |
Yes |
|
Simultaneous top and bottom 100%
net list (open/short
同時 100%
雙面測 ) |
Yes |
|
Continuity (
通路 ) voltage
250V short 25M
|
Yes |
|
Isolation (
斷路 ) voltage
250V Open 15 Ω
|
Yes |
|
Impedance test in circuit (
線路內阻抗測試 ) |
Yes |
|
Impedance test on coupon (
阻抗條測試 ) |
Yes |
